6.4 Thermal Information

THERMAL METRIC(1)

AM26LS3xAC, AM26LS32AI

AM26LS32AC

UNIT

D (SOIC)

DR (SOIC-

Reel)

N (PDIP)

NR (PDIP-

Reel)

NS (SO)

NSR (SO-

Reel)

PW

(TSSOP)

PWR

(TSSOP-

Reel)

16 PINS

16 PINS

16 PINS

16 PINS

16 PINS

16 PINS

16 PINS

16 PINS

RθJA

Junction-to-

ambient

thermal

resistance

75.7

84.6

45.3

60.6

75.8

88.5

102.7

107.5

°C/W

RθJC(top)

Junction-to-

case (top)

thermal

resistance

35

43.5

32.7

48.1

32.9

46.2

37.8

38.4

°C/W

RθJB

Junction-to-

board

thermal

resistance

33.3

43.2

25.3

40.6

36.6

50.7

47.7

53.7

°C/W

ψJT

Junction-to-

top

characterizat

ion

parameter

6.6

10.4

17.8

27.5

6

13.5

3

3.2

°C/W

ψJB

Junction-to-

board

characterizat

ion

parameter

33

42.8

25.1

40.3

36.3

50.3

47.1

53.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

AM26LS32AC, AM26LS32AI, AM26LS32AM

AM26LS33AC, AM26LS33AM

SLLS115G – OCTOBER 1980 – REVISED AUGUST 2023

Copyright © 2023 Texas Instruments Incorporated

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