8 Device and Documentation Support

8.1 Device Support

8.1.1 Device Nomenclature

Texas Instruments, Isolation Glossary

8.2 Documentation Support

8.2.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, ISO72x Digital Isolator Magnetic-Field Immunity application report

• Texas Instruments, AMC3330 Precision, ±1-V Input, Reinforced Isolated Amplifier data sheet

• Texas Instruments, TLV600x Low-Power, Rail-to-Rail In/Out, 1-MHz Operational Amplifier for Cost-Sensitive

Systems data sheet

• Texas Instruments, 18-Bit, 1-MSPS Data Acquisition Block (DAQ) Optimized for Lowest Distortion and Noise

reference guide

• Texas Instruments, 18-Bit, 1-MSPS Data Acquisition Block (DAQ) Optimized for Lowest Power reference

guide

8.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

8.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.5 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

8.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

AMC3301

SBAS917C – AUGUST 2019 – REVISED MAY 2025

www.ti.com

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