VND830MSP

Electrical specifications

Doc ID 7379 Rev 5

7/27

2.2

Thermal data

2.3

Electrical characteristics

Values specified in this section are for 8 V < VCC < 36 V; -40 °C < Tj < 150 °C, unless

otherwise stated.

Figure 3.

Current and voltage conventions

Table 4.

Thermal data (per island)

Symbol

Parameter

Value

Unit

Rthj-lead

Thermal resistance junction-lead

1.7

°C/W

Rthj-amb

Thermal resistance junction-ambient

51.7(1)

1.

When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 µm thick) connected

to all VCC pins. Horizontal mounting and no artificial air flow.

37(2)

2.

When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 µm thick) connected to

all VCC pins. Horizontal mounting and no artificial air flow.

°C/W

IS

IGND

OUTPUT 2

VCC

GND

STATUS 2

INPUT 2

IOUT2

IIN2

ISTAT2

VSTAT2

VIN2

VCC

VOUT2

OUTPUT 1

IOUT1

VOUT1

INPUT 1

IIN1

STATUS 1

ISTAT1

VIN1

VSTAT1

VF1 (*)

Note:

VFn = VCCn - VOUTn during reverse battery condition.

Obsolete

Product(s)

- Obsolete

Product(s)