8 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed below.

8.1 Documentation Support

8.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, CMOS Power Consumption and Cpd Calculation application report

• Texas Instruments, Designing With Logic application report

• Texas Instruments, Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices

application report

8.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

8.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

8.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (July 2024) to Revision B (May 2025)

Page

• Changed the key graphic on the first page of the data sheet.............................................................................1

• Added Overview section, Feature Description section, Application Information section, and Typical

Application section..............................................................................................................................................1

• Added BQB and PW packages to Pin Configuration and Functions ................................................................. 3

• Added BQB and PW packages to Thermal Information .................................................................................... 5

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CD74AC151

SCHS333B – MARCH 2003 – REVISED MAY 2025

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