DAC7562, DAC7563, DAC8162

DAC8163, DAC8562, DAC8563

SLAS719E – AUGUST 2010 – REVISED JUNE 2015

www.ti.com

Table of Contents

8.4

Device Functional Modes........................................ 32

1

Features .................................................................. 1

8.5

Programming........................................................... 36

2

Applications ........................................................... 1

9

Application and Implementation ........................ 39

3

Description ............................................................. 1

9.1

Application Information............................................ 39

4

Revision History..................................................... 2

9.2

Typical Applications ................................................ 41

5

Device Comparison Table..................................... 3

9.3

System Examples ................................................... 45

6

Pin Configuration and Functions ......................... 4

10

Power Supply Recommendations ..................... 46

7

Specifications......................................................... 5

11

Layout................................................................... 46

7.1

Absolute Maximum Ratings ...................................... 5

11.1

Layout Guidelines ................................................. 46

7.2

ESD Ratings ............................................................ 5

11.2

Layout Example .................................................... 47

7.3

Recommended Operating Conditions ....................... 5

12

Device and Documentation Support ................. 48

7.4

Thermal Information .................................................. 5

12.1

Related Links ........................................................ 48

7.5

Electrical Characteristics........................................... 6

12.2

Community Resources.......................................... 48

7.6

Timing Requirements ................................................ 9

12.3

Trademarks ........................................................... 48

7.7

Typical Characteristics ............................................ 10

12.4

Electrostatic Discharge Caution ............................ 48

8

Detailed Description ............................................ 28

12.5

Glossary ................................................................ 48

8.1

Overview ................................................................. 28

13

Mechanical, Packaging, and Orderable

8.2

Functional Block Diagram ....................................... 28

Information ........................................................... 48

8.3

Feature Description................................................. 28

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (August 2012) to Revision E

Page

•

Changed all instances of glitch energy in the data sheet to glitch impulse............................................................................ 1

•

Changed Applications list ...................................................................................................................................................... 1

•

Revised the Device Comparison Table ................................................................................................................................. 3

•

Added an I/O column to the Pin Functions table ................................................................................................................... 4

•

Added storage temperature to the Absolute Maximum Ratings table ................................................................................... 5

•

Added ESD Ratings table to the data sheet........................................................................................................................... 5

•

Added Recommended Operating Conditions table to the data sheet .................................................................................... 5

•

Deleted several notes following the Thermal Information table.............................................................................................. 5

•

Replaced the previous typical application ............................................................................................................................ 41

Changes from Revision C (June 2011, first official release) to Revision D

Page

•

Replaced text "QFN" with "SON" (name change only, package and orderable did not change) .......................................... 1

•

Typical power-down current consumption changed from 10 nA to 550 nA............................................................................ 1

•

Changed power requirements specifications.......................................................................................................................... 8

•

Power-down current vs Temperature typical characteristic plot updated, AVDD = 5.5 V...................................................... 16

•

Power-down current vs Power-supply voltage typical characteristic plot updated............................................................... 16

•

Added Power-On Reset (POR) Levels section .................................................................................................................... 31

2

Submit Documentation Feedback

Copyright © 2010–2015, Texas Instruments Incorporated

Product Folder Links: DAC7562 DAC7563 DAC8162 DAC8163 DAC8562 DAC8563