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PACKAGE OUTLINE

C

14X 0.65

2X

4.55

16X

0.30

0.19

TYP

6.6

6.2

0.15

0.05

0.25

GAGE PLANE

-8

0

1.2 MAX

3.55

2.68

2.46

1.75

B

4.5

4.3

A

NOTE 3

5.1

4.9

0.75

0.50

(0.15) TYP

PowerPAD TSSOP - 1.2 mm max height

PWP0016J

SMALL OUTLINE PACKAGE

4223595/A 03/2017

1

8

9

16

0.1

C A B

PIN 1 INDEX

AREA

SEE DETAIL A

0.1 C

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. Reference JEDEC registration MO-153.

SEATING

PLANE

TM

PowerPAD is a trademark of Texas Instruments.

A 20

DETAIL A

TYPICAL

SCALE 2.500

THERMAL

PAD

1

8

9

16