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DRV8876PWPR 数据表(PDF) 24 Page - Texas Instruments

部件名 DRV8876PWPR
功能描述  DRV8876 H-Bridge Motor Driver With Integrated Current Sense and Regulation
PDF  51 Pages
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制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

DRV8876PWPR 数据表(HTML) 24 Page - Texas Instruments

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Top and bottom layer copper area (cm2)
0
2
4
6
8
10
12
14
16
20
40
60
80
100
120
140
160
2L_R
2L 1oz
2L 2oz
Top and bottom layer copper area (cm2)
0
2
4
6
8
10
12
14
16
10
15
20
25
30
35
40
45
2L_P
2L 1oz
2L 2oz
Top layer copper area (cm2)
0
2
4
6
8
10
12
14
16
30
32
34
36
38
40
42
44
46
48
50
4L_R
4L 1oz
4L 2oz
Top layer copper area (cm2)
0
2
4
6
8
10
12
14
16
12
13
14
15
16
17
18
19
20
21
4L_P
4L 1oz
4L 2oz
24
DRV8876
SLVSDS7B – AUGUST 2019 – REVISED NOVEMBER 2019
www.ti.com
Submit Documentation Feedback
Copyright © 2019, Texas Instruments Incorporated
8.2.1.2.3.1
Steady-State Thermal Performance
"Steady-state" conditions assume that the motor driver operates with a constant RMS current over a long period
of time. Figure 21, Figure 22, Figure 23, and Figure 24 show how RθJA and ΨJB (junction-to-board
characterization parameter) change depending on copper area, copper thickness, and number of layers of the
PCB for the HTSSOP package. More copper area, more layers, and thicker copper planes decrease RθJA and
ΨJB, which indicate better thermal performance from the PCB layout.
Figure 21. HTSSOP, 4-layer PCB junction-to-ambient
thermal resistance vs copper area
Figure 22. HTSSOP, 4-layer PCB junction-to-board
characterization parameter vs copper area
Figure 23. HTSSOP, 2-layer PCB junction-to-ambient
thermal resistance vs copper area
Figure 24. HTSSOP, 2-layer PCB junction-to-board
characterization parameter vs copper area
Figure 25 and Figure 26 show how RθJA and ΨJB vary with the bottom layer copper area for the VQFN package
mounted on a 2-layer board. In the case of the 4-layer board, the top-layer copper area cannot be varied.
Figure 29 and Figure 30 at 1000 s show the steady-state RθJA of the 4-layer board.



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