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L4995 数据表(PDF) 21 Page - STMicroelectronics |
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L4995 数据表(HTML) 21 Page - STMicroelectronics |
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21 / 36 page  Package and PCB thermal data L4995 22/37 DS5053 Rev 15 4 Package and PCB thermal data 4.1 PowerSSO-12 thermal data Figure 31. PowerSSO-12 PC board Note: Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area= 77mm x 86mm,PCB thickness=1.6mm, Cu thickness=70 m (front and back side) Thermal vias separation 1.2 mm, Thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm, Footprint dimension 4.1 mm x 6.5 mm). Figure 32. Rthj-amb vs PCB copper area in open box free air condition 40 45 50 55 60 65 70 0 2 4 6 8 10 RTHj_a _amb(°C/ W) PCB Cu hea eatsink area ea (cm^ 2) GAPGMS00082 |
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