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USB3106 数据表(PDF) 4 Page - Global Connector Technology |
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USB3106 数据表(HTML) 4 Page - Global Connector Technology |
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4 / 6 page ![]() PRODUCT SPECIFICATION Part Number USB3106 Rev A Date 03/12/13 Product Description Micro USB Receptacle, Type A/B, Vertical, Through-Hole with 2.30mm (Standard) Shell Stakes Page 4 Doc Number USB3106-SPEC Prepared AO Checked RM Approved VJ www.gct.co Item Test Condition Requirement Mechanical Shock Mated USB connectors are subjected to 5.35 GRMS. 15minutes in each of three mutually perpendicular planes. In accordance with EIA-364-28. Test Condition V Test Letter A Appearance: No Damage Contact Resistance: 10 mΩ max change allowed. Discontinuity: 1 microsecond max. 6.3 Environmental Performance and Others. Item Test Condition Requirement Thermal Shock Subject the mated connectors to 10 cycles between -55°C to +85°C. In accordance with EIA364-32, Test Condition I. Appearance: No Damage Contact Resistance: 10 mΩ max change allowed. Humidity Test 168 Hours minimum (seven complete cycles) In accordance with EIA-364-31. Test Method III Appearance: No Damage Contact Resistance: 10 mΩ max change allowed. Salt Spray Subject mated/unmated connectors to 5% salt-solution concentration, 35°C for 24 hours. In accordance with EIA-364-26. No visible rust Temperature Life Mate plugs and expose to 85 +/- 2°C for 500 hours, Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. In accordance with EIA-364-17. Appearance: No Damage Contact Resistance: 10 mΩ max Change allowed. Solderability Dip solder-tails in solder bath at 245 +/- 5°C for 4.5 ~ 5.5 seconds In accordance with MIL-STD-202F, Method 208 95% of immersed area must show no voids, pin holes Resistance to Soldering Heat (Wave Solder) Subject mate connectors to chamfer with temperature: 260 +/- 5 °C time: 3-5 seconds Without deformation of case or excessive looseness of the terminals (pin) Resistance to Soldering Heat (Reflow Solder) Subject mate connectors to reflow machine with peak temperature: 260 +/- 5°C peak temperature duration: 10 seconds Without deformation of case or excessive looseness of the terminals (pin) |
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