2/13

MICROMODULES

The assembly flows is as follows:

1. Dice sawing

2. Dice attach

3. Wire bonding

4. Potting

5. Milling (depending on product)

The range of products and types of Micromodule

are summarized in Table 1 and Table 2. For large

volumes, ST is able to offer customized module

tape.

DELIVERY

The Super 35mm metallized epoxy tape is

delivered on reels, as shown in Figure 1. These

contain all of the chips from a number of wafers,

including those chips that were found to be non-

functioning during testing. Traceability is ensured

by a label fixed on the reel.

The typical quantity is 10,000 modules per reel,

with priority given to lot integrity on the reel. The

maximum quantity is 15,000 per reel.

Parts which are faulty (mechanically or electrically

defective) are identified by punch holes. The

specification for the reject punch holes is shown in

Figure 4 for the D10 micromodule, in Figure 5 for

the D15 micromodule, in Figure 6 for the D20

micromodule, and in Figure 7 for the D22

micromodule.

Tape joins (tape splicing) are never more than 10

per 10 metre length, as shown in Figure 2 and

Figure 3.

At least 2.1 m of leader, and 2.1 m of trailer is

included on each reel. Each is made of PVC Super

35 mm tape, without metalisation, and is opaque

to infrared and white light.

A “failure” marking of reject holes is included at the

beginning and end of the tape of a minimum of 5

consecutive module pitches (double positions).

Modules should be stored within the temperature

range -40

°Cto + 85 °C, for no more than 1 year.

Each reel is packed in an antistatic bag, along with

a desiccant bag, and a humidity indicator card.

This card indicates the level of humidity as follows:

30 - Blue: protection assured

40 - Pink: renew the desiccant bag

50 - Pink: protection no longer ensured

Three self adhesive plastic identification labels are

attached: one to the reel, one to the antistatic bag,

Table 2. Memory Card Products

Type

Description (please see the indiv idual product data

sheets for full specifications)

Process

Technology

Module Style

ST14C02C

1.2

µm

CMOS

D15, D20

M14C04

0.6

µm

CMOS

D20

M14C16

0.6

µm

CMOS

D20

M14C32

0.6

µm

CMOS

D20

M14C64

0.6

µm

CMOS

D22

M14128

0.6

µm

CMOS

D22

M14256

0.6

µm

CMOS

D22

ST1200

Memory Card IC, 256 bit OTP EPROM with Lock-Out

3.5

µm

NMOS

D10

ST1305B

Memory Card IC, 192 bit High Endurance EEPROM

with Secure Logic Access Control

1.5

µm

CMOS

D10, D15

ST1331

Memory Card IC, 272 bit High Endurance EEPROM

with Advanced Security Mechanisms

1.2

µm

CMOS

D10

ST1333

1.2

µm

CMOS

D10

ST1335

1.2

µm

CMOS

D10, D15

ST1336

1.2

µm

CMOS

D10, D15

M35101

Contactless Memory Chip, 13.56 MHz, 2048 bit EEPROM

0.6

µm

CMOS

C20, C30

M35102

Contactless Memory Chip with 64-bit Unique ID,

13.56 MHz, 2048 bit EEPROM

0.6

µm

CMOS

C20, C30