5.4 Thermal Information

THERMAL METRIC(1)

ISO7821

UNIT

DW (SOIC)

DWW (SOIC)

16 PINS

16-PINS

RθJA

Junction-to-ambient thermal resistance

84.7

84.7

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

47.3

46.0

°C/W

RθJB

Junction-to-board thermal resistance

49.4

54.5

°C/W

ψJT

Junction-to-top characterization parameter

19.1

18.5

°C/W

ψJB

Junction-to-board characterization parameter

48.8

53.8

°C/W

RθJC(bottom)

Junction-to-case(bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.5 Power Dissipation Characteristics

VALUE

UNIT

PD

Maximum power dissipation by ISO7821

VCC1 = VCC2 = 5.5 V, TJ = 150°C,

CL = 15 pF, input a 50 MHz 50% duty cycle

square wave

100

mW

PD1

Maximum power dissipation by side-1 of ISO7821

x

50

PD2

Maximum power dissipation by side-2 of ISO7821

x

50

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ISO7821, ISO7821F

SLLSEM2H – NOVEMBER 2014 – REVISED NOVEMBER 2024

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