Figure 11. Thermal resistance junction to ambient versus

copper surface under each lead (SMA)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

SMA

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

Figure 12. Thermal resistance versus lead length (DO-41)

Rth(°C/W)

0

20

40

60

80

100

120

5

10

15

25

Lleads(mm)

Rth(j-I)

Rth(j-a)

20

Figure 13. Thermal resistance junction to ambient versus

copper surface under each lead (SMB Flat)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SCu(cm²)

Rth(j-a) (°C/W)

SMB-Flat

Epoxy printed circuit board FR4, eCu= 35 µm

Figure 14. Thermal resistance junction to ambient versus

copper surface under each lead (SMA Flat Notch)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

SMA Flat Notch

STPS2L60

Characteristics (curves)

DS2976 - Rev 8

page 5/15