Figure 5. Relative variation of thermal impedance junction

to ambient versus pulse duration (SMA)

Z

/ R

th(j-a)

th(j-a)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

t (s)

p

Single pulse

Figure 6. Relative variation of thermal impedance junction

to ambient versus pulse duration (DO-41)

Z

/ R

th(j-a)

th(j-a)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

t (s)

p

Single pulse

Figure 7. Relative variation of thermal impedance junction

to lead versus pulse duration (SMB Flat)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

Single pulse

Z

/R

th(j-l)

th(j-l)

t (s)

p

epoxy printed circuit board FR4, copper thickness:35 µm

Figure 8. Junction capacitance versus reverse voltage

applied (typical values)

10

100

1000

1

10

100

C(pF)

V (V)

R

F=1MHz

V

=30mV

T =25°C

OSC

RMS

j

Figure 9. Reverse leakage current versus reverse voltage

applied (typical values)

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

1.E+05

0

10

20

30

40

50

60

I (µA)

R

T =125°C

j

T =150°C

j

T =100°C

j

T =50°C

j

T =25°C

j

T =75°C

j

VR(V)

Figure 10. Forward voltage drop versus forward current

0

1

2

3

4

5

6

7

8

9

10

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

I (A)

F

Tj=25°C

(maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(maximum values)

V (V)

F

Tj=125°C

Tj=125°C

(typical values)

STPS2L60

Characteristics (curves)

DS2976 - Rev 8

page 4/15