Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered

trademarks of Cree, Inc.

2

xlAMP xP-c lEDS

characteristics

characteristics

unit

minimum

typical

maximum

Thermal resistance, junction to solder point - white, royal blue, blue

°C/W

12

Thermal resistance, junction to solder point - green

°C/W

20

Thermal resistance, junction to solder point - amber

°C/W

15

Thermal resistance, junction to solder point - red, red-orange

°C/W

10

Viewing angle (FWHM) - white

degrees

115

Viewing angle (FWHM) - royal blue, blue, green, red, red-orange, amber

degrees

125

Temperature coefficient of voltage - white, blue, royal blue, green

mv/°C

-4.0

Temperature coefficient of voltage - amber, red-orange, red

mv/°C

-2.0

ESD withstand voltage (HBM per Mil-Std-883D) - white, royal blue, blue, green

v

8000

ESD Classification (HBM per Mil-Std-883D) - amber, red-orange, red

Class 2

DC forward current - white, royal blue, blue, green

mA

500

DC forward current - amber, red-orange, red

mA

350

Reverse voltage

v

5

Forward voltage (@ 350 mA) - white

v

3.2

3.9

Forward voltage (@ 350 mA) - royal blue, blue

v

3.3

3.9

Forward voltage (@ 350 mA) - green

v

3.4

3.9

Forward voltage (@ 350 mA) - amber, red-orange, red

v

2.2

2.5

Forward voltage (@ 125 mA) - royal blue, blue

v

3.1

Forward voltage (@ 125 mA) - green

v

3.3

Forward voltage (@ 125 mA) - red-orange, red

v

2.0

Forward voltage (@ 125 mA) - amber

v

2.1

Forward voltage (@ 500 mA) - royal blue, blue, white

v

3.5

Forward voltage (@ 500 mA) - green

v

3.6

LeD junction temperature

°C

150