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TL082ACDR 数据表(PDF) 26 Page - Texas Instruments

部件名 TL082ACDR
功能描述  TL08xx FET-Input Operational Amplifiers
PDF  78 Pages
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制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

TL082ACDR 数据表(HTML) 26 Page - Texas Instruments

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8.2.1.3 Application Curve
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
0
0.5
1
1.5
2
Time (ms)
VIN
VOUT
Figure 8-2. Input and Output Voltages of the Inverting Amplifier
8.3 Power Supply Recommendations
CAUTION
Supply voltages larger than 36V for a single-supply or outside the range of ±18V for a dual-supply
can permanently damage the device (see Section 5.1).
Place 0.1μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high
impedance power supplies. For more detailed information on bypass capacitor placement, see Section 8.4.
8.4 Layout
8.4.1 Layout Guidelines
For best operational performance of the device, use good PCB layout practices, including:
• Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the
operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low impedance
power sources local to the analog circuitry.
– Connect low-ESR, 0.1μF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
• Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCB are typically devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Keep digital and analog grounds
physically separate, and pay attention to the flow of the ground current.
• To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If
not possible to keep them separate, cross the sensitive trace perpendicular as opposed to in parallel with the
noisy trace.
• Place the external components as close to the device as possible. Keeping RF and RG close to the inverting
input minimizes parasitic capacitance, as shown in Section 8.4.2.
• Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
• Consider a driven, low-impedance guard ring around the critical traces. A guard ring significantly helps
reduce leakage currents from nearby traces that are at different potentials.
TL081, TL081A, TL081B, TL081H
TL082, TL082A, TL082B, TL082H
TL084, TL084A, TL084B, TL084H
SLOS081O – FEBRUARY 1977 – REVISED SEPTEMBER 2025
www.ti.com
26
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Copyright © 2025 Texas Instruments Incorporated
Product Folder Links: TL081 TL081A TL081B TL081H TL082 TL082A TL082B TL082H TL084 TL084A TL084B TL084H



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