PACKAGE OUTLINE

DQN0004A

X2SON - 0.4 mm max height

PLASTIC SMALL OUTLINE - NO LEAD

4215302/D 06/2016

NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2.

This drawing is subject to change without notice.

3.

The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

4.

Features may not exist. Recommend use of pin 1 marking on top of package for orientation purposes.

23

TLV733P

www.ti.com

SBVS235C – OCTOBER 2014 – REVISED JULY 2019

Product Folder Links: TLV733P

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