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TLV752

SBVS383A – DECEMBER 2019 – REVISED MARCH 2020

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The absolute maximum rating is VIN + 0.3 V or 6.0 V, whichever is smaller

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, VIN

–0.3

6.5

V

Enable voltage, VEN;

–0.3

6.5

V

Feedback Voltage, VFB

–0.3

2.0

V

Output voltage, VOUT

–0.3

VIN + 0.3

(2)

V

Operating junction temperature, TJ

–40

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

Minimun derated capacitance of 0.47 μF is required for stability

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

1.5

6.0

V

VOUT

Output voltage

0.55

5.5

V

IOUT

Output current

0

1

A

CIN

Input capacitor

1

μF

COUT

Output capacitor(1)

1

220

μF

VEN

Enable voltage

0

6.0

V

fEN

Enable toggle frequency

10

kHz

TJ

Junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

TLV752

UNIT

DSQ (WSON)

10 PINS

RθJA

Junction-to-ambient thermal resistance

74.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

90.5

°C/W

RθJB

Junction-to-board thermal resistance

39.7

°C/W

ψJT

Junction-to-top characterization parameter

3.8

°C/W

ψJB

Junction-to-board characterization parameter

39.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

17

°C/W