INx

OUTx

GND

ENx

½

TLV752P

V

OUT

V

IN

FBx

C

IN

C

OUT

V

EN

R

2

R

1

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TLV752

SBVS383A – DECEMBER 2019 – REVISED MARCH 2020

TLV752 Dual, 1-A, High-Accuracy, Adjustable-LDO in a Small-Size Package

1

1 Features

1

•

Input voltage range: 1.5 V to 6.0 V

•

Adjustable output voltage:

–

0.55 V to 5.5 V

•

Very low dropout:

–

225 mV (max) at 1 A (3.3 VOUT)

•

High output accuracy:

–

1.5%, maximum over temperature

•

IQ: 25 µA (typical)

•

Built-in soft-start with monotonic VOUT rise

•

Package:

–

2-mm × 2-mm 10-Pin WSON (DSQ)

•

Active output discharge

2 Applications

•

Microservers and tower servers

•

Door and window sensors

•

Portable point-of-sale (EPOS)

•

Wearable fitness and activity monitors

•

Scanners

•

Wi-Fi access points

•

Communication modules

3 Description

The TLV752 is a dual, adjustable, 1-A low-dropout

(LDO) regulator. This device is available in a small,

10-pin, 2-mm × 2-mm WSON package and consumes

25-µA quiescent current while providing fast line and

load transient response. The TLV752 features a low

dropout of 225 mV that can help improve the overall

power efficiency.

The TLV752 wide input-and-output voltage ranges,

when combined with its output current capability in a

small printed circuit board (PCB) footprint help

support a wide variety of applications from sensor

supplies,

to

auxiliary

rails,

and

modern

microcontrollers with lower core voltages.

The TLV752 is stable with small ceramic output

capacitors, allowing for a small overall solution size.

A precision band-gap and error amplifier provides

high accuracy of 1.5% (max) over temperature. This

device includes integrated thermal shutdown, current

limit,

active

output-discharge,

and

undervoltage

lockout (UVLO) features. The TLV752 has an internal

fold-back current-limit to reduce thermal dissipation

during short-circuit events.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

TLV752

WSON (10)

2.00 mm × 2.00 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Typical Application