7.4 Layout

7.4.1 Layout Guidelines

• Place input and output capacitors as close as possible to the device.

• Use copper planes for device connections to optimize thermal performance.

• Place thermal vias around the device to distribute the heat.

• For packages with thermal pads, solder the thermal pad to copper to achieve best thermal resistance.

Thermal resistance increases significantly when the thermal pad is not soldered.

7.4.2 Layout Examples

VOUT

VIN

GND PLANE

Represents via used for

application specific connections

1

2

3

4

5

C

OUT

C

IN

EN

Figure 7-7. Layout Example: DBV Package

VIN

VOUT

GND PLANE

Represents via used for

application specific connections

1

2

3

4

6

C

IN

C

OUT

EN

5

Figure 7-8. Layout Example: DRV Package

VEN

VOUT

VIN

GND PLANE

1

2

3

6

5

CIN

COUT

Thermal

Pad

Represents via used for

application specific connections

Figure 7-9. Layout Example: DYD Package

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TLV757P

SBVS322C – OCTOBER 2017 – REVISED MARCH 2024

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