1.1

Electrical characteristics (curves)

Figure 1. Average forward power dissipation versus

average forward current

0.0

0.4

0.8

1.2

1.6

2.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

δ = 0.05 δ = 0.1 δ = 0.2

δ = 0.5 δ = 1

T

δ =tp/T

tp

I

(A)

F(AV)

P

(W)

F(AV)

Figure 2. Forward voltage drop versus forward current

(typical values)

0.01

0.10

1.00

10.00

0.0

0.4

0.8

1.2

1.6

2.0

2.4

I (A)

F

T = 25°C

j

T = 150°C

j

V (V)

F

Figure 3. Forward voltage drop versus forward current

(maximum values)

0.01

0.10

1.00

10.00

0.0

0.4

0.8

1.2

1.6

2.0

2.4

2.8

3.2

I (A)

F

T = 150°C

j

T = 25°C

j

V (V)

F

Figure 4. Relative variation of thermal impedance junction

to lead versus pulse duration

Z

/R

th(j- )

th(j- )

l

l

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Single pulse

SMBflat

t (s)

p

Figure 5. Junction capacitance versus reverse voltage

applied (typical values)

1

10

100

1

10

100

1000

C (pF)

F = 1 MHz

VOSC = 30 mVRMS

Tj = 25 °C

V (V)

R

Figure 6. Thermal resistance junction to ambient versus

copper surface under each lead

R

(°C/W)

th(j-a)

0

25

50

75

100

125

150

175

200

0

1

2

3

4

5

6

7

8

9

10

epoxy printed circuit board FR4, copper thickness: 35 µm

S

(cm²)

cu

STTH110-Y

Electrical characteristics (curves)

DS10077 - Rev 2

page 3/8