TMP512 datasheet(3/62 Pages) TI2

3 / 62 page

TMP512

TMP513

www.ti.com

SBOS491A

– JUNE 2010 – REVISED MAY 2011

THERMAL INFORMATION

TMP512AIRSAR

TMP512

TMP512AIRSAT

THERMAL METRIC(1)

UNITS

D (SOIC)

RSA

θJA

Junction-to-ambient thermal resistance

91.1

34.3

θJC(top)

Junction-to-case(top) thermal resistance

10.6

35.4

θJB

Junction-to-board thermal resistance

40.3

11.6

°C/W

ψJT

Junction-to-top characterization parameter

49.1

0.5

ψJB

Junction-to-board characterization parameter

47.5

11.6

θJC(bottom)

Junction-to-case(bottom) thermal resistance

N/A

2.7

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION

TMP513AIRSAR

TMP513AID

TMP513AIRSAT

THERMAL METRIC(1)

UNITS

D (SOIC)

RSA

θJA

Junction-to-ambient thermal resistance

77.6

44.8

θJC(top)

Junction-to-case(top) thermal resistance

55.0

43.8

θJB

Junction-to-board thermal resistance

49.9

14.7

°C/W

ψJT

Junction-to-top characterization parameter

3.5

0.4

ψJB

Junction-to-board characterization parameter

32.2

14.5

θJC(bottom)

Junction-to-case(bottom) thermal resistance

N/A

2.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

TMP512 数据表(PDF) 3 Page - Texas Instruments

TMP512 数据表(HTML) 3 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62

数据表下载