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ADRF5238BCRZN-R7 数据表(PDF) 6 Page - Analog Devices |
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ADRF5238BCRZN-R7 数据表(HTML) 6 Page - Analog Devices |
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6 / 13 page ![]() Data Sheet ADRF5238 ABSOLUTE MAXIMUM RATINGS analog.com Rev. 0 | 6 of 13 For recommended operating conditions, see Table 1 and Table 2. Table 3. Absolute Maximum Ratings Parameter Rating Supply Voltage −0.3V to +5.8V Digital Control Inputs1 Voltage −0.5V to 3.6V Current 3mA RF Input Power (VDD = 5V)2, 3 Through Path Average 36dBm Peak4 36dBm Terminated Path Average 28dBm Peak 30dBm Hot Switching (RFC) Average 34dBm Peak 34dBm Hot Switching (RFx) Average 28dBm Peak 30dBm RF Input Power (VDD = 3.3V) Through Path Average 34dBm Peak 34dBm Terminated Path Average 27dBm Peak 29dBm Hot Switching (RFC) Average 32dBm Peak 32dBm Hot Switching (RFx) Average 27dBm Peak 29dBm RF Power Under Unbiased Condition (VDD = 0V) 18dBm Temperature Junction (Tj) 135°C Storage −65°C to +150°C Reflow 260°C 1 Overvoltages at the digital control inputs are clamped by internal diodes. Current must be limited to the maximum rating given. 2 For power derating over frequency, see Figure 2 and Figure 3. 3 For 105°C operation, the average power handling degrades 3dB, and the peak power handling degrades 1dB from the TCASE = 85°C specifications. 4 Peak: (≤100 ns pulse duration, 5% duty cycle). Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability. Only one absolute maximum rating can be applied at any one time. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the junction to case bottom (channel to package bottom) thermal resistance (see Table 4). Table 4. Thermal Resistance Package Type θJC Unit CR-12-1 Through Path 57 °C/W Terminated Path 100 °C/W POWER DERATING CURVES Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C Figure 3. Power Derating vs. Frequency, High Frequency Detail, TCASE = 85°C |
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