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STTH25M06 数据表(PDF) 4 Page - STMicroelectronics |
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STTH25M06 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 13 page ![]() 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current (square waveform) 0 20 40 60 80 100 0 8 16 24 32 40 P(W) I (A) F(AV) T δ=tp/T tp δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 δ = 1 Figure 2. Forward voltage drop versus forward current (typical values) 0.1 1.0 10.0 100.0 1000.0 0.0 1.0 2.0 3.0 4.0 5.0 I (A) F Tj=150 °C Tj=25 °C V (V) F Figure 3. Forward voltage drop versus forward current (maximum values) 0.1 1.0 10.0 100.0 1000.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 I (A) F Tj=150 °C Tj=25 °C V (V) F Figure 4. Relative variation of thermal impedance, junction to case versus pulse duration (DPAK) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Z th(j-c)/Rth(j-c) Single pulse tp(s) Figure 5. Relative variation of thermal impedance, junction to case versus pulse duration (TO-220FPAC) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Z th(j-c)/Rth(j-c) Single pulse TO-220FPAC tp(s) Figure 6. Peak reverse recovery current versus dIF/dt (typical values) 0 4 8 12 16 0 50 100 150 200 250 300 350 400 450 500 I RM(A) IF = IF(AV) VR=400V dIF/dt(A/µs) T j = 125 °C STTH25M06 Characteristics (curves) DS13169 - Rev 2 page 4/13 |
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