5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

4.6

V

VIN

Control input voltage(2) (2) (3)

–0.5

7

V

VI/O

Switch I/O voltage(2) (3) (4)

–0.5

7

V

IIK

Control input clamp current

VIN < 0

–50

mA

II/OK

I/O port clamp current

VI/O < 0

–50

mA

II/O

ON-state switch current(5)

±120

mA

Continuous current through VCC or GND

±100

mA

θJA

Package thermal impedance(6)

DRC package

48.7

°C/W

RSE package

243

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(4)

VI and VO are used to denote specific conditions for VI/O.

(5)

II and IO are used to denote specific conditions for II/O.

(6)

The package thermal impedance is calculated in accordance with JESD 51-7.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/

ESDA/JEDEC JS-001(1)

I/O pins to GND

±12000

V

Pins GND, OE, S and VCC

±7000

Contact discharge (IEC 61000-4-2)

I/O pins to GND

±7000

Charged-device model (CDM), per JEDEC specification JESD-002(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

See (1).

MIN

MAX

UNIT

VCC

Supply voltage

2.3

3.6

V

VIH

High-level control input voltages

VCC = 2.3 V to 2.7 V

0.46 × VCC

V

VCC = 2.7 V to 3.6 V

0.46 × VCC

VIL

Low-level control input voltage

VCC = 2.3 V to 2.7 V

0.25 × VCC

V

VCC = 2.7 V to 3.6 V

0.25 × VCC

VI/O

Data input/output voltage(2)

0

5.5

V

TA

Operating free-air temperature

–40

85

°C

(1)

All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the Implications of

Slow or Floating CMOS Inputs application note.

(2)

The I/O pins are 5.5V tolerant and functional for the entire range. However, for VI/O >3.6V, channel RON will be high. Use 3.3V power

supply for best results.

TS3USB221E

SCDS263E – SEPTEMBER 2009 – REVISED JULY 2024

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