NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments

literature number SLUA271 (www.ti.com/lit/slua271)

.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

EXAMPLE BOARD LAYOUT

4224376 / C 06/2021

www.ti.com

VQFN - 1 mm max height

RGE0024C

PLASTIC QUAD FLATPACK- NO LEAD

SYMM

SYMM

LAND PATTERN EXAMPLE

SCALE: 20X

2X

(0.8)

2X(0.8)

(3.8)

( 2.1)

1

6

7

12

13

18

19

24

25

24X (0.6)

24X (0.24)

20X (0.5)

(R0.05)

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

METAL

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

(Ø0.2) VIA

TYP

(3.8)