SSM2301

Rev. A | Page 14 of 16

OUTLINE DIMENSIONS

1

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50

REF

0.50

0.40

0.30

2.75

BSC SQ

TOP

VIEW

12° MAX

0.70 MAX

0.65TYP

SEATING

PLANE

PIN 1

INDICATOR

0.90 MAX

0.85 NOM

0.30

0.23

0.18

0.05 MAX

0.01 NOM

0.20 REF

1.89

1.74

1.59

4

1.60

1.45

1.30

3.00

BSC SQ

5

8

Figure 30. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

3 mm × 3 mm Body, Very Thin, Dual Lead

(CP-8-2)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-187-AA

0.80

0.60

0.40

8°

0°

4

8

1

5

PIN 1

0.65 BSC

SEATING

PLANE

0.38

0.22

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.08

3.20

3.00

2.80

5.15

4.90

4.65

0.15

0.00

0.95

0.85

0.75

Figure 3

1. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature

Range

Package Description

Package

Option

Branding

SSM2301CPZ-R21

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

CP-8-2

A1C

SSM2301CPZ-REEL1

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

CP-8-2

A1C

SSM2301CPZ-REEL71

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

CP-8-2

A1C

SSM2301RMZ-R21

−40°C to +85°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

A1C

SSM2301RMZ-REEL1

−40°C to +85°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

A1C

SSM2301RMZ-REEL71

−40°C to +85°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

A1C

SSM2301-EVALZ1

Evaluation Board with LFCSP Model