ADA4853-1/ADA4853-2/ADA4853-3

Rev. C | Page 16 of 16

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-203-AB

0.22

0.08

0.30

0.15

1.00

0.90

0.70

SEATING

PLANE

4

5

6

3

2

1

PIN 1

0.65 BSC

1.30 BSC

0.10 MAX

0.10 COPLANARITY

0.40

0.10

1.10

0.80

2.20

2.00

1.80

2.40

2.10

1.80

1.35

1.25

1.15

0.46

0.36

0.26

Figure 52. 6-Lead Thin Shrink Small Outline Transistor Package [SC70]

(KS-6)—Dimensions shown in millimeters

4.50

4.40

4.30

14

8

7

1

6.40

BSC

PIN 1

5.10

5.00

4.90

0.65

BSC

SEATING

PLANE

0.15

0.05

0.30

0.19

1.20

MAX

1.05

1.00

0.80

0.20

0.09

8°

0°

0.75

0.60

0.45

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB-1

Figure 53. 14-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-14)—Dimensions shown in millimeters

1

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50 REF

0.50

0.40

0.30

0.25 MIN

0.45

2.75

BSC SQ

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

0.90

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

3.00

BSC SQ

*1.65

1.50 SQ

1.35

16

5

13

8

9

12

4

EXPOSED

PAD

(BOTTOM VIEW)

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2

EXCEPT FOR EXPOSED PAD DIMENSION.

Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad (CP-16-3)—Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature

Range

Package Description

Ordering

Quantity

Package

Option

Branding

ADA4853-1AKSZ-R21

–40°C to +85°C

6-Lead Thin Shrink Small Outline Transistor Package (SC70)

250

KS-6

HEC

ADA4853-1AKSZ-R71

–40°C to +85°C

6-Lead Thin Shrink Small Outline Transistor Package (SC70)

3,000

KS-6

HEC

ADA4853-1AKSZ-RL1

–40°C to +85°C

6-Lead Thin Shrink Small Outline Transistor Package (SC70)

10,000

KS-6

HEC

ADA4853-2YCPZ-R21

–40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

250

CP-16-3

H0H

ADA4853-2YCPZ-RL1

–40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

5,000

CP-16-3

H0H

ADA4853-2YCPZ-RL71

–40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

1,500

CP-16-3

H0H

ADA4853-3YCPZ-R21

–40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

250

CP-16-3

H0L

ADA4853-3YCPZ-RL1

–40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

5,000

CP-16-3

H0L

ADA4853-3YCPZ-R71

–40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

1,500

CP-16-3

H0L

ADA4853-3YRUZ1

–40°C to +105°C

14-Lead Thin Shrink Small Outline Package (TSSOP)

96

RU-14

ADA4853-3YRUZ-RL1

–40°C to +105°C

14-Lead Thin Shrink Small Outline Package (TSSOP)

2,500

RU-14

ADA4853-3YRUZ-R71

–40°C to +105°C

14-Lead Thin Shrink Small Outline Package (TSSOP)

1,000

RU-14

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D05884-0-10/07(C)