L6206

14/23

PARALLELED OPERATION

The outputs of the L6206 can be paralleled to increase the output current capability or reduce the power dissi-

pation in the device at a given current level. It must be noted, however, that the internal wire bond connections

from the die to the power or sense pins of the package must carry current in both of the associated half bridges.

current rating is not increased since the total current must still flow through one bond wire on the power supply

or sense pin. In addition the over current detection senses the sum of the current in the upper devices of each

bridge (A or B) so connecting the two halves of one bridge in parallel does not increase the over current detec-

tion threshold.

For most applications the recommended configuration is Half Bridge 1 of Bridge A paralleled with the Half Bridge

1 of the Bridge B, and the same for the Half Bridges 2 as shown in Figure 13. The current in the two devices

When connected in this configuration the over current detection circuit, which senses the current in each bridge

(A and B), will sense the current in upper devices connected in parallel independently and the sense circuit with

the lowest threshold will trip first. With the enables connected in parallel, the first detection of an over current in

either upper DMOS device will turn of both bridges. Assuming that the two DMOS devices share the current

equally, the resulting over current detection threshold will be twice the minimum threshold set by the resistors

In this configuration the resulting Bridge has the following characteristics.

- Equivalent Device: FULL BRIDGE

- 5.6A max RMS Load Current

- 11.2A max OCD Threshold

Figure 13. Parallel connection for higher current

LOAD

1

5

21

18

19

8

16

GND

GND

GND

GND

POWER

GROUND

SIGNAL

GROUND

+

-

VS

4

VCP

VBOOT

20

IN2

12

6

7

9

EN

23

11

IN1

2

14

24

17

3

15

22

10

13

D02IN1364