THERMAL DATA

Symbol

Description

Value

Unit

Thermal Resistance Junction-pins

Thermal Resistance Junction-ambient (**)

Max.

Max.

14

52

°C/W

°C/W

Notes

(*) Pulse width (limited only by junction temperature and by the transient thermal resistance.

(**) Mounted on board with 16cm

µm thickness copper area on board heatsink.

ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

Peak Output Sustaining Voltage

15

V

Supply Voltage

15

V

µsec; 10% d.c.)

18

V

Charge Pump Input Voltage

30

V

Logic Input Voltage

-0.3 to 7

V

PWM VREF--LIN VREF Input Voltage

-0.3 to 7

V

Sense Input Voltage

-1 to 7

V

Sink-Source Peak Output Current (*)

3.5

A

Sink-Source DC Output Current

1.8

A

°C)

1.5

W

Storage and Junction Temperature

-40 to 150

°C

Ω; C = 180pF;

°C, unless otherwise specified)

Symbol

Parameter

Test Condition

Min.

Typ.

Max.

Unit

Supply Voltage

10.5

12

13.5

V

Quiescent Supply Current

BRK = L; INUA = INUB = INUC

= L; INLA = INLB = INLC = H;

Table 1

0.3

0.5

mA

BRK = H; INUA = INUB = INUC

= H; INLA = INLB = INLC = L;

Table 1

46

mA

Output Leakage Current

1

mA

Sink Out ON Resistance

°C (see Fig.4)

0.42

0.47

Ω

°C

0.7

Ω

Source Out ON Resistance

°C (see Fig.4)

0.42

0.47

Ω

°C

0.7

Ω

Body Diode Forward Drop (sink

and source)

1

1.5

V

Brake Delay Time

See Fig. 1, 3; note1

210

ms

Braking Time

10

s

LIN Vref Input Bias Current

400

950

nA

PWM Vref Input Bias Current

400

950

nA

Reference Voltage Input

Ω

2V

0.4

V

Sense Amplifier Voltage Gain

Ω; Note 2

3.7

4

4.3

V/V

L6232E

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