THERMAL CHARACTERISTICS

On the application, the L6245 must be soldered

on a PCB system. The Traks Area, depending on

the lenght and the width of each track, must be

between 2 to 10 square mm. An area of 10 mm

2

can give a typ. Thermal Resistance Junction-to-

Ambient value of 85

°C/W (See Fig. 2): this value

refer3 to a Total Power Dissipated Power of 1W.

Fig. 9 shows the increase of the Rth j-amb when

the Dissipated Power decreases.

Practically, very useful information is the change

of the thermal resistance (Thermal Impedance)

versus a single pulse of power width or versus the

time the dissipation begins.

Fig. 4 shows this Thermal Impedance trend.

Figure 3: Typical Junction-to-Ambient Thermal

Resistance vs. Total Dissipated

Power. (L6245 mounted on a typical

PCB)

Figure 4: Typical Transient Thermal Impedance

vs. Time or Pulse Width. (L6245

mounted on a typical PCB)

L6245

13/15