THERMAL CHARACTERISTICS

POWERDIP. The thermal resistance is referred

to the thermal path from the dissipating region

on the top surface of the silicon chip, to the

points along the four central pins of the pack-

age, at a distance of 1.5 mm away from the

stand-offs.

SO. Similarly, the reference point is the knee

on the four central pins, where the pins are up-

wardly bent and the soldering joint with the

PCB footprint can be made.

If a dissipating surface, thick at least 35

µm,

and with a surface similar or bigger than the

one shown, is created making use of the

printed circuit.

Such heatsinking surface is considered on the

bottom side of an horizontal PCB (worst case).

If the power dissipating pins (the four central

ones), as well as the others, have a minimum

thermal connection with the external world

(very thin strips only) so that the dissipation

takes place through still air and through the

PCB itself.

It is the same situation of point above, without

any heatsinking surface created on purpose on

the board.

Additional data for the PowerDip package can be

found in:

Application Note 9030:

Thermal Characteristics of the PowerDip

20,24 Packages Soldered on 1,2,3 oz.

Copper PCB

THERMAL DATA

Symbol

Parameter

DIP20

SO20

Unit

Thermal Resistance, Junction to Pin

12

17

°C/W

Thermal Resistance, Junction to Ambient (see Thermal

Characteristics)

40

65

°C/W

Thermal Resistance, Junction to Ambient (see Thermal

Characteristics)

50

80

°C/W

Figure 1: Printed Heatsink

L6374

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