WILCS02IC datasheet(34/71 Pages) MICROCHIP

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WILCS02IC and WILCS02 Family

Electrical Specifications

Data Sheet

DS70005557C - 34

Table 3-12. WILCS02IC Receiver Performance Characteristics(1) (continued)

RF Characteristics

Standard Operating Conditions:

VDD=VDDIO= 3.0V to 3.6V (unless

otherwise stated)

Operating Temperature:

-40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +105°C for V-temp

Param. No. Characteristics

Description(5)

Min.

Typ

Max.

Units

WF_RX_3

Sensitivity 802.11g

6 Mbps OFDM

—

-92

—

dBm

9 Mbps OFDM

—

-91

—

12 Mbps OFDM

—

-89

—

18 Mbps OFDM

—

-87

—

24 Mbps OFDM

—

-84

—

36 Mbps OFDM

—

-81

—

48 Mbps OFDM

—

-76

—

54 Mbps OFDM(6)

—

-75

—

WF_RX_4

Sensitivity 802.11n (Bandwidth at

20 MHz) (Both long GI and short

GI)

MCS 0

—

-90

—

dBm

MCS 1

—

-87

—

MCS 2

—

-85

—

MCS 3

—

-82

—

MCS 4

—

-79

—

MCS 5

—

-74

—

MCS 6

—

-73

—

MCS 7(6)

—

-71

—

WF_RX_5

Maximum receive signal level

1, 2 Mbps DSSS

-3

—

dBm

5.5, 11 Mbps CCK

-3

—

6 Mbps OFDM

-3

—

54 Mbps OFDM

-7.2

—

MCS 0

-3

—

MCS 7

-7

—

WF_RX_6

Adjacent channel rejection

1 Mbps DSSS (30 MHz offset)

43.5

—

11 Mbps CCK (25 MHz offset)

39.5

—

6 Mbps OFDM (25 MHz offset)

39.5

—

54 Mbps OFDM (25 MHz offset)

21.5

—

MCS 0 – 20 MHz Bandwidth (25

MHz offset)

38.5

—

MCS 7 – 20 MHz Bandwidth (25

MHz offset)

19.5

—

WF_RX_7

RSSI accuracy

—

-5

—

Notes:

1. Measured after RF matching network (assume 50Ω impedance)

2. RF performance is ensured at 3.3V, 25°C, with a 2-3 dB change at boundary conditions.

3. The availability of some specific channels and/or operational frequency bands are country-dependent and must be

programmed in the host product at the factory to match the intended destination. Regulatory bodies prohibit exposing

the settings to the end user. This requirement needs to be taken care of via host implementation.

4. The host product manufacturer must ensure that the RF behavior adheres to the certification (for example, FCC, ISED)

requirements when the module is installed in the final host product.

5. This parameter is characterized but not tested in manufacturing.

6. This parameter is characterized and tested in manufacturing.

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