WILCS02UE datasheet(28/71 Pages) MICROCHIP

28 / 71 page

WILCS02IC and WILCS02 Family

Device Overview

Data Sheet

DS70005557C - 28

• Do not exceed a peak temperature (TP) of 250°C.

• For specific reflow profile recommendations from the vendor, refer to the Solder Paste Data Sheet.

• Use no-clean flux solder paste.

• Do not wash as moisture can be trapped under the shield.

• Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.

2.8.1

Cleaning

The exposed GND pad helps to self-align the module, avoiding pad misalignment. The

recommendation is to use the no clean solder pastes. Ensure full drying of no-clean paste fluxes as

a result of the reflow process. As per the recommendation by the solder paste vendor, this requires

longer reflow profiles and/or peak temperatures toward the high end of the process window. The

uncured flux residues can lead to corrosion and/or shorting in accelerated testing and possibly the

field.

2.9

WILCS02 Module Assembly Considerations

The WILCS02 Module is assembled with an Electro-Magnetic Interference (EMI) shield to ensure

compliance with EMI emission and immunity rules. The EMI shield is made of a tin-plated steel

(SPTE) and is not hermetically sealed. Solutions like IPA and similar solvents can be used to clean the

WILCS02 Module. However, do not use the cleaning solutions that contain acid on the module.

2.9.1

Conformal Coating

The modules are not intended for use with a conformal coating, and the customer assumes all risks

(such as the module reliability, performance degradation and so on) if a conformal coating is applied

to the modules.

WILCS02UE 数据表(PDF) 28 Page - Microchip Technology