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MPC7448 数据表(PDF) 13 Page - Freescale Semiconductor, Inc |
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MPC7448 数据表(HTML) 13 Page - Freescale Semiconductor, Inc |
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13 / 60 page ![]() MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4 Freescale Semiconductor 13 Electrical and Thermal Characteristics Table 7 provides the power consumption for the MPC7448 part numbers described by this document; see Section 11.1, “Part Numbers Fully Addressed by This Document,” for information regarding which part numbers are described by this document. Freescale also offers MPC7448 part numbers that meet lower power consumption specifications by adhering to lower core voltage and core frequency specifications. For more information on these devices, including references to the MPC7448 Hardware Specification Addenda that describe these devices, see Section 11.2, “Part Numbers Not Fully Addressed by This Document.” The power consumptions provided in Table 7 represent the power consumption of each speed grade when operated at the rated maximum core frequency (see Table 8). Freescale sorts devices by power as well as by core frequency, and power limits for each speed grade are independent of each other. Each device is tested at its maximum core frequency only. (Note that Deep Sleep Mode power consumption is independent of clock frequency.) Operating a device at a frequency lower than its rated maximum is fully supported provided the clock frequencies are within the specifications given in Table 8, and a device operated below its rated maximum will have lower power consumption. However, inferences should not be made about a device’s power consumption based on the power specifications of another (lower) speed grade. For example, a 1700 MHz device operated at 1420 MHz may not exhibit the same power consumption as a 1420 MHz device operated at 1420 MHz. For all MPC7448 devices, the following guidelines on the use of these parameters for system design are suggested. The Full-Power Mode–Typical value represents the sustained power consumption of the device High-impedance (off-state) leakage current: Vin = OVDD Vin = GND —ITSI — 50 – 50 µA 2, 3, 4 Output high voltage @ IOH = –5 mA 1.5 VOH OVDD – 0.45 — V 1.8 OVDD – 0.45 — 2.5 1.8 — Output low voltage @ IOL = 5 mA 1.5 VOL —0.45 V 1.8 — 0.45 2.5 — 0.6 Capacitance, Vin = 0 V, f = 1 MHz All inputs Cin —8.0 pF 5 Notes: 1. Nominal voltages; see Table 4 for recommended operating conditions. 2. All I/O signals are referenced to OVDD. 3. Excludes test signals and IEEE Std. 1149.1 boundary scan (JTAG) signals 4. The leakage is measured for nominal OVDD and VDD, or both OVDD and VDD must vary in the same direction (for example, both OVDD and VDD vary by either +5% or –5%). 5. Capacitance is periodically sampled rather than 100% tested. 6. These pins have internal pull-up resistors. Table 6. DC Electrical Specifications (continued) At recommended operating conditions. See Table 4. Characteristic Nominal Bus Voltage 1 Symbol Min Max Unit Notes |
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