Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison......................................................... 3

6 Pin Configuration and Functions...................................4

7 Specifications.................................................................. 6

7.1 Absolute Maximum Ratings ....................................... 6

7.2 ESD Ratings .............................................................. 6

7.3 Recommended Operating Conditions ........................6

7.4 Thermal Information ...................................................7

7.5 Electrical Characteristics ............................................8

7.6 Timing Requirements .................................................9

7.7 Timing Diagrams.......................................................10

7.8 Typical Characteristics.............................................. 11

8 Detailed Description......................................................16

8.1 Overview................................................................... 16

8.2 Functional Block Diagram......................................... 16

8.3 Feature Description...................................................16

8.4 Device Functional Modes..........................................19

9 Application and Implementation.................................. 20

9.1 Application Information............................................. 20

9.2 Typical Application - Voltage Rail Monitoring............ 20

9.3 Typical Application - Overvoltage Monitoring............22

10 Power Supply Recommendations..............................23

11 Layout........................................................................... 24

11.1 Layout Guidelines................................................... 24

11.2 Layout Example...................................................... 24

12 Device and Documentation Support..........................26

12.1 Device Support....................................................... 26

12.2 Documentation Support.......................................... 27

12.3 Receiving Notification of Documentation Updates..27

12.4 Support Resources................................................. 27

12.5 Trademarks.............................................................27

12.6 Electrostatic Discharge Caution..............................27

12.7 Glossary..................................................................27

13 Mechanical, Packaging, and Orderable

Information.................................................................... 27

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision I (Feb 2021) to Revision J (May 2021)

Page

• Updated Device Naming Nomenclature figure by adding Pinout Indicator (DBZ Package Only) from Pinout

Indicator ............................................................................................................................................................. 3

• Updated pin numbering of Figure 6-5 (X2SON) package and updated Pin Functions Table............................. 4

• Updated X2SON (DPW) Layout Example........................................................................................................ 24

Changes from Revision H (December 2020) to Revision I (February 2021)

Page

• Remove duplicate package.............................................................................................................................. 27

Changes from Revision G (October 2020) to Revision H (December 2020)

Page

• Added Reset time delay variant F specification..................................................................................................9

Changes from Revision F (June 2020) to Revision G (October 2020)

Page

• Updated the numbering format for tables, figures and cross-references throughout the document...................1

• Added additional threshold voltages (VIT-) and new package information .........................................................1

• Updated Device Naming Nomenclature figure to include (DBZ) V pinout option .............................................. 3

• Added new (DBZ) package option (Pin 3 = GND, V pinout) and updated Pin Functions Table..........................4

• Added layout example for (DBZ) V pinout package..........................................................................................24

• Modified Device Naming Convention table to include additional threshold voltages (VIT-), reset time delay

options and pinout indicator options................................................................................................................. 26

Changes from Revision E (April 2020) to Revision F (June 2020)

Page

• Changed DPW package from Advanced Information to Production Data.......................................................... 1

• Changed DPW package Information ................................................................................................................. 4

Changes from Revision D (February 2020) to Revision E (April 2020)

Page

• Added X2SON (DPW) package option .............................................................................................................. 3

TLV803E, TLV809E, TLV810E

SLVSES2J – AUGUST 2018 – REVISED MAY 2021

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