PL133-97

DS20007036A-page 12

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2025 Microchip Technology Inc. and its subsidiaries

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L

E

N

0.50 BSC

0.20 REF

1.65

0.35

0.20

0.70

0.00

0.25

0.40

1.70

0.75

--

3.00 BSC

MILLIMETERS

MIN

NOM

16

1.75

4.45

0.30

0.80

0.05

MAX

K

0.25 REF

Terminal-to-Exposed-Pad

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Overall Length

Exposed Pad Length

D

D2

1.65

3.00 BSC

1.70

1.75

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

Microchip Technology Drawing C04-01264 Rev A

16-Lead Very, Very Thin Quad Flatpack No-Lead (Q) 3x3x0.8 mm Body [WQFN]

Package Code: NEA