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2025 Microchip Technology Inc. and its subsidiaries

DS20007036A-page 13

PL133-97

RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Center Pad Width

Contact Pad Spacing

Center Pad Length

Contact Pitch

Y2

X2

1.75

1.75

MILLIMETERS

0.50 BSC

MIN

E

MAX

3.00

Contact Pad Length (X16)

Contact Pad Width (X16)

Y1

X1

0.80

0.30

NOM

1

16

C1

Contact Pad Spacing

3.00

Contact Pad to Contact Pad (X12)

G2

0.20

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, pleease refer to current industry standard IPC-7093.

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Contact Pad to Center Pad (X16)

G1

0.20

Microchip Technology Drawing C04-03264 Rev A

C1

C2

SILK SCREEN

X1

1

X

E

X2

Y2

16-Lead Very, Very Thin Quad Flatpack No-Lead (Q) 3x3x0.8 mm Body [WQFN]

Package Code: NEA

EV

EV

G2

G1

Y1

X1

ØV