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STM32L4P5CEU6P 数据表(PDF) 290 Page - STMicroelectronics |
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STM32L4P5CEU6P 数据表(HTML) 290 Page - STMicroelectronics |
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290 / 311 page ![]() Package information STM32L4P5xx 290/311 DS12903 Rev 2 7.5 WLCSP100 package information WLCSP100 is a 100-ball, 4.437 x 4.456 mm, 0.4 mm pitch wafer level chip scale package. Figure 88. WLCSP100 outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. A K B09Q_ME_V1 A1 ORIENTATION REFERENCE BOTTOM VIEW BUMP SIDE SIDE VIEW TOP VIEW WAFER BACK SIDE 1 10 DETAIL A DETAIL A e e D e2 E G F e1 D E (4X) aaa BUMP eee Z SEATING PLANE Z Z Z X Y b(100X) A1 |
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