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STM32L4P5CEU6P 数据表(PDF) 291 Page - STMicroelectronics |
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STM32L4P5CEU6P 数据表(HTML) 291 Page - STMicroelectronics |
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291 / 311 page  DS12903 Rev 2 291/311 STM32L4P5xx Package information 307 Figure 89. WLCSP100 recommended footprint Table 128. WLCSP100 mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.520 0.550 0.580 0.0205 0.0217 0.0228 A1 0.155 0.170 0.185 0.0061 0.0067 0.0073 A2 0.355 0.380 0.405 0.0140 0.0150 0.0159 A3(2) 2. Back side coating. 0.020 0.025 0.030 0.0008 0.0010 0.0012 Ø b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.230 0.255 0.280 0.0091 0.0100 0.0110 D 4.417 4.437 4.457 0.1739 0.1747 0.1755 E 4.436 4.456 4.476 0.1746 0.1754 0.1762 e - 0.400 - - 0.0157 - e1 - 3.600 - - 0.1417 - e2 - 3.600 - - 0.1417 - F - 0.420 - - 0.0165 - G - 0.430 - - 0.0169 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 BGA_WLCSP_FT_V1 Dsm Dpad |
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