Chomerics

25

Materials Needed

• Clean lint-free cloth rag

• Industrial solvent

• Rubber gloves

For optimal performance,

Chomerics recommends interface

flatness of 0.001 in/in (0.025 mm/25

mm) to 0.002 in/in (0.050 mm/25

mm) maximum.

Step 1: Ensure that bonding

surfaces are free from oil, dust, or

any contamination that may affect

bonding. Using rubber gloves, wipe

surfaces with a cloth dampened

with industrial solvents such as

MEK, toluene, acetone or isopropyl

alcohol.

Step 2: Cut tape to size* and

remove a liner or remove pre-cut

tape from roll.

*Note: Due to variations in heat

sink surfaces, Chomerics’ data

indicates that it sometimes

is beneficial to be cut slightly

smaller than the area of the heat

sink. See illustration.

Step 3: Apply to center of heat sink

bonding area and smooth over

entire surface using moderate hand

pressure / rubbing motion. A roller

may be useful to help smooth the

part to the surface by rolling from

the center out to beyond the edges

of the part. This ensures optimal

contact between tape and heat sink.

Step 4: Center heat sink onto

component and apply using any one

of the recommended temperature/

pressure options:

More pressure equals better

wetting out of the adhesive to the

contact surfaces. A twisting motion

during assembly of the substrates

will typically improve wetting.

Note that typically 70% of the

ultimate adhesive bond strength

is achieved with initial application,

and 80-90% is reached within 15

minutes. Ultimate adhesive strength

is achieved within 36 hours;

however the next manufacturing

step can typically occur immediately

following the initial application.

Removal Instructions

Materials needed: Single-edged

razor blade or a small, thin-bladed

pocketknife; soft, thin metal

spatula. Use safety precautions

when handling sharp instruments

and organic solvents.

Step 1: Carefully insert the blade

edge into the bond line at a corner

THERMATTACH® Tape

between the heat sink and the

component. The penetration need

not be very deep.

Step 2: Remove the blade and insert

the spatula into the wedge. Slowly

twist the spatula blade so that it

exerts a slight upward pressure.

Step 3: As the two surfaces start

to separate, move the spatula

blade deeper into the bond line and

continue the twisting motion and

upward force.

Step 4: After the two components

are separated, the tape can be

removed and discarded. If adhesive

remains on the component surfaces,

it must be removed. Wipe with a

clean rag (lint-free) dabbed with

MEK, toluene, or isopropyl alcohol.

Use sufficient solvent to remove all

adhesive.

Step 5: Solvent cleaned components

must be verified 100% free

of cleaning solvent prior to

reattachment of adhesive.

* Performance rated on a scale of 1-5, 5 being the best. N/R = Not Recommended.

Thermally Conductive Attachment Tapes

Typical Properties

T418

T412

T404 / T414

T405 / T405-R

T411

Ceramic Attachment

5

3

4

4

4

Metal Attachment

5

3

4

4

4

Plastic Attachment

N/R

N/R

N/R

N/R

5

Dielectric Performance

3

N/R

5

N/R

N/R

Thermal Performance

2

5

3

4

2

Relative Thermal Performance

Minimum: 10 psi at room

temperature for 15 seconds

PREFERRED: 30 psi at room

temperature for 5 seconds

THERMATTACH® Thermally Conductive Attachment Tapes

Tape Application Instructions: T404, T405, T405-R, T411, T412, T413, T414, T418