STM32L462CEU6 datasheet(9/198 Pages) STMICROELECTRONICS

9 / 198 page

DocID029969 Rev 1

9/198

STM32L462CE STM32L462RE STM32L462VE

List of tables

Table 92.

UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184

Table 93.

UFBGA64 recommended PCB design rules (0.5 mm pitch BGA) . . . . . . . . . . . . . . . . . . 185

Table 94.

WLCSP64 - 64-ball, 3.357x3.657 mm 0.4 mm pitch wafer level chip scale

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188

Table 95.

WLCSP64 recommended PCB design rules (0.4 mm pitch) . . . . . . . . . . . . . . . . . . . . . . 189

Table 96.

UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191

Table 97.

Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193

Table 98.

STM32L462xx ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196

Table 99.

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197

STM32L462CEU6 数据表(PDF) 9 Page - STMicroelectronics