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STM32L462CEU6 数据表(PDF) 148 Page - STMicroelectronics |
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STM32L462CEU6 数据表(HTML) 148 Page - STMicroelectronics |
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148 / 198 page  Electrical characteristics STM32L462CE STM32L462RE STM32L462VE 148/198 DocID029969 Rev 1 Figure 28. Typical connection diagram using the ADC 1. Refer to Table 63: ADC characteristics for the values of RAIN, RADC and CADC. 2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (refer to Table 58: I/O static characteristics for the value of the pad capacitance). A high Cparasitic value will downgrade conversion accuracy. To remedy this, fADC should be reduced. 3. Refer to Table 58: I/O static characteristics for the values of Ilkg. General PCB design guidelines Power supply decoupling should be performed as shown in Figure 14: Power supply scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as close as possible to the chip. |
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