STM32L462CEU6 datasheet(179/198 Pages) STMICROELECTRONICS

部件名	STM32L462CEU6

功能描述	Ultra-low-power ARM® Cortex®-M4 32-bit MCUFPU, 100DMIPS, 512KB Flash, 160KB SRAM, analog, audio, AES

PDF	198 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

179 / 198 page

DocID029969 Rev 1

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STM32L462CE STM32L462RE STM32L462VE

Package information

195

Figure 43. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid

array

package recommended footprint

Device marking

The following figure gives an example of topside marking orientation versus ball A1 identifier

location.

Other optional marking or inset/upset marks, which identify the parts throughout supply

chain operations, are not indicated below.

0.700

0.750

0.800

0.0276

0.0295

0.0315

ddd

0.100

0.0039

eee

0.150

0.0059

fff

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Table 90. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA)

Dimension

Recommended values

Pitch

0.5

Dpad

0.280 mm

Dsm

0.370 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.280 mm

Stencil thickness

Between 0.100 mm and 0.125 mm

Table 89. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array

package mechanical data (continued)

Symbol

millimeters

inches(1)

Min.

Typ.

Max.

Min.

Typ.

Max.

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