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MICRF002 数据表(PDF) 9 Page - Micrel Semiconductor |
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MICRF002 数据表(HTML) 9 Page - Micrel Semiconductor |
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9 / 16 page ![]() March 2003 9 MICRF002/RF022 MICRF002/RF022 Micrel Step 3: Selecting The C TH Capacitor Extraction of the dc value of the demodulated signal for purposes of logic-level data slicing is accomplished using the external threshold capacitor C TH and the on-chip switched- capacitor “resistor” R SC, shown in the block diagram. Slicing level time constant values vary somewhat with de- coder type, data pattern, and data rate, but typically values range from 5ms to 50ms. Optimization of the value of C TH is required to maximize range. Selecting Capacitor C TH The first step in the process is selection of a data-slicing-level time constant. This selection is strongly dependent on sys- tem issues including system decode response time and data code structure (that is, existence of data preamble, etc.). This issue is covered in more detail in Application Note 22. The effective resistance of R SC is listed in the electrical characteristics table as 145k Ω at 315MHz, this value scales linearly with frequency. Source impedance of the CTH pin at other frequencies is given by equation (4), where f T is in MHz: (4) R 145k 4.8970 f SC T =Ω τ of 5x the bit-rate is recommended. Assuming that a slicing level time constant τ has been established, capacitor C TH may be computed using equation (5) C R TH SC = τ A standard ±20% X7R ceramic capacitor is generally suffi- cient. Refer to Application Hint 42 for C TH and CAGC selection examples. Step 4: Selecting The C AGC Capacitor The signal path has AGC (automatic gain control) to increase input dynamic range. The attack time constant of the AGC is set externally by the value of the C AGC capacitor connected to the CAGC pin of the device. To maximize system range, it is important to keep the AGC control voltage ripple low, preferably under 10mVpp once the control voltage has at- tained its quiescent value. For this reason capacitor values of at least 0.47 µF are recommended. The AGC control voltage is carefully managed on-chip to allow duty-cycle operation of the MICRF002. When the device is placed into shutdown mode (SHUT pin pulled high), the AGC capacitor floats to retain the voltage. When opera- tion is resumed, only the voltage droop due to capacitor leakage must be replenished. A relatively low-leakage ca- pacitor is recommended when the devices are used in duty- cycled operation. To further enhance duty-cycled operation, the AGC push and pull currents are boosted for approximately 10ms immedi- ately after the device is taken out of shutdown. This compen- sates for AGC capacitor voltage droop and reduces the time to restore the correct AGC voltage. The current is boosted by a factor of 45. Selecting C AGC Capacitor in Continuous Mode A C AGC capacitor in the range of 0.47µF to 4.7µF is typically recommended. The value of the C AGC should be selected to minimize the ripple on the AGC control voltage by using a sufficiently large capacitor. However if the capacitor is too large the AGC may react too slowly to incoming signals. AGC settling time from a completely discharged (zero-volt) state is given approximately by Equation 6: (6) ∆t 1.333C 0.44 AGC =− where: C AGC is in µF, and ∆t is in seconds. Selecting C AGC Capacitor in Duty-Cycle Mode Voltage droop across the C AGC capacitor during shutdown should be replenished as quickly as possible after the IC is enabled. As mentioned above, the MICRF002 boosts the push-pull current by a factor of 45 immediately after start-up. This fixed time period is based on the reference oscillator frequency f T. The time is 10.9ms for fT = 6.00MHz, and varies inversely with f T. The value of CAGC capacitor and the duration of the shutdown time period should be selected such that the droop can be replenished within this 10ms period. Polarity of the droop is unknown, meaning the AGC voltage could droop up or down. Worst-case from a recovery stand- point is downward droop, since the AGC pull-up current is 1/10th magnitude of the pulldown current. The downward droop is replenished according to the Equation 7: (7) I C V t AGC = ∆ ∆ where: I = AGC pullup current for the initial 10ms (67.5 µA) C AGC = AGC capacitor value ∆t = droop recovery time ∆V = droop voltage For example, if user desires ∆t = 10ms and chooses a 4.7µF C AGC, then the allowable droop is about 144mV. Using the same equation with 200nA worst case pin leakage and assuming 1 µA of capacitor leakage in the same direction, the maximum allowable ∆t (shutdown time) is about 0.56s for droop recovery in 10ms. The ratio of decay-to-attack time-constant is fixed at 10:1 (that is, the attack time constant is 1/10th of the decay time constant). Generally the design value of 10:1 is adequate for the vast majority of applications. If adjustment is required the constant may be varied by adding a resistor in parallel with the C AGC capacitor. The value of the resistor must be determined on a case by case basis. Step 5: Selecting The Demod Filter Bandwidth The inputs SEL0 and SEL1 control the demodulator filter bandwidth in four binary steps (625Hz to 5000Hz in sweep, 1250Hz to 10000Hz in fixed mode), see Table 1. Bandwidth must be selected according to the application. The demodu- lator bandwidth should be set according to equation 8. |
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