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TS4855 数据表(PDF) 24 Page - STMicroelectronics |
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TS4855 数据表(HTML) 24 Page - STMicroelectronics |
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24 / 27 page  TS4855 Package Information 24/27 7 PACKAGE INFORMATION Flip-chip package—18 bumps: TS4855IJT Marking (on top view) Package mechanical data s ST LOGO s Part number: B55 s Three digit Datecode: YWW s The dot is for marking the bump1A ❑ Die size: 2440µm x 2170µm ±30µm ❑ Die height (including bumps): 600µm ❑ Nominal Bumps diameter: 315µm ±10µm ❑ Nominal Bumps height: 250µm ±10µm ❑ Pitch: 500µm ±10µm ❑ Die Height : 350µm ±20µm 866µm 866µm 500µm 750µm 2440µm 2170µm 600µm 866µm 866µm 500µm 750µm 2440µm 2170µm 600µm |
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