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AP40G04GD 数据表(PDF) 2 Page - A POWER MICROELECTRONICS |
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AP40G04GD 数据表(HTML) 2 Page - A POWER MICROELECTRONICS |
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2 / 10 page ![]() AP40G04GD 40V N+P-Channel Enhancement Mode MOSFET AP40G04GD REV1.1 永源微電子科技有限公司 Electrical Characteristics (TJ=25℃, unless otherwise noted) Symbol Parameter Conditions Min. Typ. Max. Unit BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 40 44 --- V △BVDSS/△TJ BVDSS Temperature Coefficient Reference to 25 ℃ , ID=1mA --- 0.028 --- V/ ℃ RDS(ON) Static Drain-Source On-Resistance VGS=10V , ID=30A --- 8.0 10 mΩ VGS=4.5V , ID=15A --- 10 16 VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.2 1.6 2.5 V △VGS(th) VGS(th) Temperature Coefficient --- -6.16 --- mV/ ℃ IDSS Drain-Source Leakage Current VDS=40V , VGS=0V , TJ=25 ℃ --- --- 1 uA VDS=40V , VGS=0V , TJ=55 ℃ --- --- 5 IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- --- ±100 nA gfs Forward Transconductance VDS=5V , ID=30A --- 22 --- S Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 1.7 3.4 Ω Qg Total Gate Charge (4.5V) VDS=20V , VGS=10V , ID=25A --- 37 --- nC Qgs Gate-Source Charge --- 6 --- Qgd Gate-Drain Charge --- 7 --- Td(on) Turn-On Delay Time VDD=30V , VGS=10V , RG=1Ω ID=25A --- 12 --- ns Tr Rise Time --- 12 --- Td(off) Turn-Off Delay Time --- 38 --- Tf Fall Time --- 9 --- Ciss Input Capacitance VDS=20V , VGS=0V , f=1MHz --- 2400 --- pF Coss Output Capacitance --- 192 --- Crss Reverse Transfer Capacitance --- 165 --- IS Continuous Source Current1,5 VG=VD=0V , Force Current --- --- 50 A ISM Pulsed Source Current2,5 --- --- 200 A VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 ℃ --- --- 1.2 V trr Reverse Recovery Time IF=30A , dI/dt=100A/µs ,TJ=25 ℃ --- 22 --- nS Qrr Reverse Recovery Charge --- 11 --- nC Note : 1、The data tested by surface mounted on a 1 inch 2 FR-4 board with 2OZ copper. 2、The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 3、The EAS data shows Max. rating . The test condition is VDD=36V,VGS =10V,L=0.1mH,IAS =16A 4、The power dissipation is limited by 150℃ junction temperature 5、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation |
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