THERMAL CHARACTERISTICS

TYPICAL CHARACTERISTIC CURVES

1

1.05

1.1

1.15

1.2

1.25

1.3

1.35

1.4

-40 -25 -10

5

20 35

50

65 80

95

110 125

AirFlowat7cf/m,

Low-KBoard

5V,Vth+

3.3V,Vth+

5V,Vth-

3.3V,Vth-

T -Free-AirTemperature- C

A

°

0

5

10

15

20

25

30

35

40

45

-40 -25 -10

5

20

35

50

65

80

95

110 125

T -Free-AirTemperature- C

A

°

3.3V

5V

Load=15pF,

AirFlowat7cf/m,

Low-KBoard

ISO7240CF

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

168

θ

JA

Junction-to-air

°C/W

High-K Thermal Resistance

96.1

θ

JB

Junction-to-Board Thermal Resistance

61

°C/W

θ

JC

Junction-to-Case Thermal Resistance

48

°C/W

Device Power Dissipation

220

mW

Input a 12.5 MHz 50% duty cycle square wave

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

REGULATORY INFORMATION

UL

File Number: E181974

(1)

Production tested

≥ 3000 VRMS for 1 second in accordance with UL

1577.

PROPAGATION DELAY

INPUT THRESHOLD VOLTAGE

vs

vs

FREE-AIR TEMPERATURE

FREE-AIR TEMPERATURE

Figure 5.

Figure 6.

Copyright © 2007–2008, Texas Instruments Incorporated

Submit Documentation Feedback

9

Product Folder Link(s) :ISO7240CF