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AOZ8000CI 数据表(PDF) 4 Page - Alpha & Omega Semiconductors |
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AOZ8000CI 数据表(HTML) 4 Page - Alpha & Omega Semiconductors |
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4 / 4 page ![]() 4 V. Reliability Evaluation A. Failure Rate Prediction FIT rate (per billion): see note 1 MTBF = see note 1 1 The presentation of FIT rate for the individual product reliability is restricted by the limited burn-in sample size of AOZ8000CI. The calculation will be presented (using the method discussed below) on the final qualification report when more data are available. AOS uses industry standard techniques (JEDEC Standard JESD 85) for failure rate prediction by applying the Arrhenius equation with an activation energy of 0.7eV and 60% of upper confidence level on the failure rate calculation. FIT means one failure per billion hours. The failure rate and MTBF are calculated as follows: AF = exp{(Ea/k) x [1/T0-1/Ts]} Looking up the χ 2 /2 table (see above) for zero failure (see HTOL result above) with 60% confidence, the value of (χ 2[CL,(2f+2)] /2) is 0.92. Failure Rate = Chi2 [CL, (2f+2)] x 10 9 / [ 2 (ss) (t) (AF)] MTBF = 10 9 / FIT Chi² ( χ 2 ) = Chi Squared Distribution, determined by the number of failures and confidence interval ss = Total Number of units from HTOL testing t = Duration of HTOL testing AF = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [AF] = exp [Ea / k (1/Tj u – 1/Tj s)] Tj s = Stressed junction temperature in degree (Kelvin), K = C+273 Tj u = Used junction temperature in degree (Kelvin), K = C+273 k = Boltznan’s constant, 8.617x10 -5 V / K B. Package Qualification Testing Package qual. testing are performed (see section IV) to ensure the product meet AOS quality and reliability standards. VI. Quality Assurance Information Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual. Guaranteed Outgoing Defect Rate: < 50 ppm Quality Sample Plan: conform to Mil-Std-105D |
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