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AP4435A 数据表(PDF) 2 Page - A POWER MICROELECTRONICS

部件名 AP4435A
功能描述  30V P-Channel Enhancement Mode MOSFET
PDF  9 Pages
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制造商  APME [A POWER MICROELECTRONICS]
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标志 APME - A POWER MICROELECTRONICS

AP4435A 数据表(HTML) 2 Page - A POWER MICROELECTRONICS

  AP4435A Datasheet HTML 1Page - A POWER MICROELECTRONICS AP4435A Datasheet HTML 2Page - A POWER MICROELECTRONICS AP4435A Datasheet HTML 3Page - A POWER MICROELECTRONICS AP4435A Datasheet HTML 4Page - A POWER MICROELECTRONICS AP4435A Datasheet HTML 5Page - A POWER MICROELECTRONICS AP4435A Datasheet HTML 6Page - A POWER MICROELECTRONICS AP4435A Datasheet HTML 7Page - A POWER MICROELECTRONICS AP4435A Datasheet HTML 8Page - A POWER MICROELECTRONICS AP4435A Datasheet HTML 9Page - A POWER MICROELECTRONICS  
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AP4435A
30V P-Channel Enhancement Mode MOSFET
AP4435A Rve1.3
永源微電子科技有限公司
Electrical Characteristics (TJ=25℃, unless otherwise noted)
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
BVDSS
Drain-Source Breakdown Voltage
VGS=0V , ID=-250uA
-30
-32
---
V
BVDSS/△TJ
BVDSS Temperature Coefficient
Reference to 25℃ , ID=-1mA
---
-0.022
---
V/℃
RDS(ON)
Static Drain-Source On-Resistance2
VGS=-10V , ID=-10A
---
12
16
VGS=-4.5V , ID=-5A
---
18
24
VGS(th)
Gate Threshold Voltage
VGS=VDS , ID =-250uA
-1.0
-1.6
-2.5
V
VGS(th)
VGS(th) Temperature Coefficient
---
4.6
---
mV/℃
IDSS
Drain-Source Leakage Current
VDS=-24V , VGS=0V , TJ=25℃
---
---
-1
uA
VDS=-24V , VGS=0V , TJ=55℃
---
---
-5
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=-5V , ID=-5A
---
17
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
13
---
Ω
Qg
Total Gate Charge (-4.5V)
VDS=-15V , VGS=-4.5V , ID=-
6A
---
30
---
nC
Qgs
Gate-Source Charge
---
6
---
Qgd
Gate-Drain Charge
---
9
---
Td(on)
Turn-On Delay Time
VDD=-15V , VGS=-10V ,
RG=3.3Ω,
ID=-6A
---
10
---
ns
Tr
Rise Time
---
26
---
Td(off)
Turn-Off Delay Time
---
35
---
Tf
Fall Time
---
8
---
Ciss
Input Capacitance
VDS=-15V , VGS=0V , f=1MHz
---
1800
---
pF
Coss
Output Capacitance
---
305
---
Crss
Reverse Transfer Capacitance
---
216
---
IS
Continuous Source Current1,5
VG=VD=0V , Force Current
---
---
-10
A
ISM
Pulsed Source Current2,5
---
---
-50
A
VSD
Diode Forward Voltage2
VGS=0V , IS=-1A , TJ=25℃
---
---
-1.2
V
trr
Reverse Recovery Time
IF=-6A , dI/dt=100A/µs ,
TJ=25℃
---
16.3
---
nS
Qrr
Reverse Recovery Charge
---
5.9
---
nC
Note :
1、The data tested by surface mounted on a 1 inch 2 FR-4 board with 2OZ copper.
2、The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3、The EAS data shows Max. rating . The test condition is VDD=-25V,VGS=-10V,L=0.1mH,IAS=-38A
4、The power dissipation is limited by 150℃ junction temperature
5、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.



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