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M50LPW041K 数据表(PDF) 7 Page - STMicroelectronics |
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M50LPW041K 数据表(HTML) 7 Page - STMicroelectronics |
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7 / 37 page ![]() 7/37 M50LPW041 Communication Frame, LFRAME, is Low, VIL, as Clock rises and the correct Start cycle is on LAD0- LAD3. On the following Clock cycles the Host will send the Cycle Type + Dir, Address, other control bits, Data0-Data3 and Data4-Data7 on LAD0- LAD3. The memory outputs Sync data until the wait-states have elapsed. Refer to Table 8, LPC Bus Write Field Definitions, and Figure 6, LPC Bus Write Waveforms, for a description of the Field definitions for each clock cycle of the transfer. See Table 23, LPC Interface AC Signal Timing Characteristics and Figure 10, LPC Interface AC Signal Timing Waveforms, for details on the timings of the signals. Bus Abort. The Bus Abort operation can be used to immediately abort the current bus operation. A Bus Abort occurs when LFRAME is driven Low, VIL, during the bus operation; the memory will tri- state the Input/Output Communication pins, LAD0-LAD3. Note that, during a Bus Write operation, the Command Interface starts executing the command as soon as the data is fully received; a Bus Abort during the final TAR cycles is not guaranteed to abort the command; the bus, however, will be released immediately. Standby. When LFRAME is High, VIH, the memory is put into Standby mode where LAD0- LAD3 are put into a high-impedance state and the Supply Current is reduced to the Standby level, ICC1. Reset. During Reset mode all internal circuits are switched off, the memory is deselected and the outputs are put in high-impedance. The memory is in Reset mode when Interface Reset, RP, or CPU Reset, INIT, is Low, VIL. RP or INIT must be held Low, VIL, for tPLPH. The memory resets to Read mode upon return from Reset mode and the Lock Registers return to their default states regardless of their state before Reset, see Table 16. If RP or INIT goes Low, VIL, during a Program or Erase operation, the operation is aborted and the memory cells affected no longer contain valid data; the memory can take up to tPLRH to abort a Program or Erase operation. Block Protection. Block Protection can be forced using the signals Top Block Lock, TBL, and Write Protect, WP, regardless of the state of the Lock Registers. Address/Address Multiplexed (A/A Mux) Bus Operations The Address/Address Multiplexed (A/A Mux) Interface has a more traditional style interface. The signals consist of a multiplexed address signals (A0-A10), data signals, (DQ0-DQ7) and three control signals (RC, G, W). An additional signal, RP, can be used to reset the memory. The Address/Address Multiplexed (A/A Mux) Interface is included for use by Flash Programming equipment for faster factory programming. Only a subset of the features available to the Low Pin Count (LPC) Interface are available; these include all the Commands but exclude the Security features and other registers. The following operations can be performed using the appropriate bus cycles: Bus Read, Bus Write, Output Disable and Reset. When the Address/Address Multiplexed (A/A Mux) Interface is selected all the blocks are unprotected. It is not possible to protect any blocks through this interface. Table 5. Absolute Maximum Ratings (1) Note: 1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi- tions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant qual- ity documents. 2. Minimum Voltage may undershoot to -2V and for less than 20ns during transitions. Maximum Voltage may overshoot to VCC +2V and for less than 20ns during transitions. Symbol Parameter Value Unit TA Ambient Operating Temperature (Temperature Range Option 1) 0 to 70 °C TBIAS Temperature Under Bias –50 to 125 °C TSTG Storage Temperature –65 to 150 °C VIO (2) Input or Output Voltage –0.6 to VCC + 0.6 V VCC Supply Voltage –0.6 to 4 V VPP Program Voltage –0.6 to 13 V |
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